Service composition in stochastic settings

With the growth of the Internet-of-Things and online Web services, more services with more capabilities are available to us. The ability to generate new, more useful services from existing ones has been the focus of much research for over a decade. The goal is, given a specification of the behavior of the target service, to build a controller, known as an orchestrator, that uses existing services to satisfy the requirements of the target service. The model of services and requirements used in most work is that of a finite state machine. This implies that the specification can either be satisfied or not, with no middle ground. This is a major drawback, since often an exact solution cannot be obtained. In this paper we study a simple stochastic model for service composition: we annotate the tar- get service with probabilities describing the likelihood of requesting each action in a state, and rewards for being able to execute actions. We show how to solve the resulting problem by solving a certain Markov Decision Process (MDP) derived from the service and requirement specifications. The solution to this MDP induces an orchestrator that coincides with the exact solution if a composition exists. Otherwise it provides an approximate solution that maximizes the expected sum of values of user requests that can be serviced. The model studied although simple shades light on composition in stochastic settings and indeed we discuss several possible extensions

Preface

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R&D for new silicon pixel sensors for the High Luminosity phase of the CMS experiment at LHC

The High Luminosity upgrade of the CERN LHC collider (HLLHC) demands a new high-radiation–tolerant solid-state pixel sensor capable of surviving fluencies up to a few 1016 neq/cm2 at ∼ 3 cm from the interaction point. To this extent the INFN ATLAS-CMS joint research activity, in collaboration with Fondazione Bruno Kessler (FBK), is aiming at the development of thin n-in-p–type pixel sensors for the HL-LHC. The R&D covers both planar and single-sided 3D columnar pixel devices made with the Si-Si Direct Wafer Bonding technique, which allows for the production of sensors with 100 μm and 130 μm active thickness for planar sensors, and 130 μm for 3D sensors, the thinnest ones ever produced so far. The first prototypes of hybrid modules, bump-bonded to the present CMS readout chip, have been tested on beam. The first results on their performance before and after irradiation are presented

Performance of prototype BTeV silicon pixel detectors in a high energy pion beam

The silicon pixel vertex detector is a key element of the BTeV spectrometer. Sensors bump-bonded to prototype front-end devices were tested in a high energy pion beam at Fermilab. The spatial resolution and occupancies as a function of the pion incident angle were measured for various sensor-readout combinations. The data are compared with predictions from our Monte Carlo simulation and very good agreement is found.Comment: 24 pages, 20 figure

Beam Test Results of the BTeV Silicon Pixel Detector

The results of the BTeV silicon pixel detector beam test carried out at Fermilab in 1999-2000 are reported. The pixel detector spatial resolution has been studied as a function of track inclination, sensor bias, and readout threshold.Comment: 8 pages of text, 8 figures, Proceedings paper of Pixel 2000: International Workshop on Semiconductor Pixel Detectors for Particles and X-Rays, Genova, June 5-8, 200

The INFN R&D: New pixel detector for the High Luminosity upgrade of the LHC

The High Luminosity upgrade of the CERN-LHC (HL-LHC) demands for a new high-radiation tolerant solid-state pixel sensor capable of surviving fluencies up to a few 1016 particles/cm2 at ∼3 cm from the interaction point. To this extent the INFN ATLAS-CMS joint research activity, in collaboration with Fondazione Bruno Kessler-FBK, is aiming at the development of thin n-in-p type pixel sensors for the HL-LHC. The R&D covers both planar and single-sided 3D columnar pixel devices made with the Si-Si Direct Wafer Bonding technique, which allows for the production of sensors with 100 μm and 130 μm active thickness for planar sensors, and 130 μm for 3D sensors, the thinnest ones ever produced so far. The first prototypes of hybrid modules bump-bonded to the present CMS and ATLAS readout chips have been tested in beam tests. The preliminary results on their performance before and after irradiation are presented

Beam Test of BTeV Pixel Detectors

The silicon pixel vertex detector is one of the key elements of the BTeV spectrometer. Detector prototypes were tested in a beam at Fermilab. We report here on the measured spatial resolution as a function of the incident angles for different sensor-readout electronics combinations. We compare the results with predictions from our Monte Carlo simulation.Comment: 7 pages, 5 figures, Invited talk given by J.C. Wang at "Vertex 2000, 9th International Workshop on Vertex Detectors", Michigan, Sept 10-15, 2000. To be published in NIM

Radiation tolerance of the CMS forward pixel detector

In this paper we present some results on the radiation tolerance of the CMS forward pixel detector. They were obtained from a beam test at Fermilab of a pixel-detector module, which was previously irradiated up to a maximum dose of 45 Mrad of protons at 200 MeV. It is shown that CMS forward pixel detector can tolerate this radiation dose without any major deterioration of its performance. © 2008 Elsevier B.V

A High Statistics Measurement of the Lambdac+ Lifetime

A high statistics measurement of the Lambdac+ lifetime from the Fermilab fixed-target FOCUS photoproduction experiment is presented. We describe the analysis technique with particular attention to the determination of the systematic uncertainty. The measured value of 204.6 +/- 3.4 (stat.) +/- 2.5 (syst.) fs from 8034 +/- 122 Lambdac -> pKpi decays represents a significant improvement over the present world average.Comment: Submitted to Physical Review Letter